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Cinterion Launches First LGA Scalable Modules for M2M Markets Worldwide
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Cinterion Wireless Modules, a global leader in cellular machine-to-machine (M2M) communication modules, today announced at the Mobile World Congress tradeshow the worldwide availability of its new land grid array (LGA) modules - EES3, EGS5, EGS3, BGS3. The new modules are optimized for size and performance and feature solderable LGA surface mount technology for efficient, fully automated manufacturing and process consistency.
The new LGA series modules are part of Cinterion's Evolution Platform modules, which offer scalability, a broad range of specialized features, an ultra compact footprint and compatibility with existing products for full design flexibility. All Evolution Platform LGA series modules are fully type approved.
"Cinterion's unique type of LGA technology was designed with a focus on reliability and flexibility to meet the demanding requirements of M2M applications," said Norbert Muhrer, CEO, Cinterion Wireless Modules. "With the new LGA products, Cinterion delivers on our promise to provide forward-thinking, sustainable solutions for our customers as well as to innovate new technology to advance the M2M market."
As with all Cinterion Evolution Platform modules, the new LGA series features an advanced ARM9 processor design combined with the field-proven and reliable Cinterion M2M software stack. The latest silicon chip technology enables high performance and improved efficiency along with the benefit of long-term availability. The new Evolution Platform LGA series modules include:
- EES3 " One of the smallest EDGE modules in the world allowing the fastest transmission in GSM standards. The EES3 features an integrated TCP/IP stack over AT, serial and USB ports, and a RIL driver for Microsoft® Windows" Mobile 6.1 based devices.
- EGS5 - Offers embedded JAVA" processing based on a state-of-the-art ARM 9 processor architecture. Other features include GPRS Class 12 functionality, an integrated TCP/IP stack over AT, and an array of industrial interfaces such as SPI, I²C bus, USB, AD/DA converter, and multiple GPIOs.
- EGS3 - Offers enhanced M2M connectivity with GPRS Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial interfaces SPI, I²C, and USB port.
- BGS3 - Basic M2M functionality with GPRS Class 10 functionality, two serial interfaces, an integrated TCP/IP stack over AT, and an RIL driver for Microsoft® Windows" Mobile 6.1 based devices.
For more information about Cinterion Wireless Modules' new LGA series or the Evolution Platform, please visit us online: www.cinterion.com.
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